An effect of Radiation Heat Transfer on the Thermal Dissipation from the Electronic Chip in an Enclosure

밀폐공간에 놓인 전자 칩의 열발산에 복사 열전달이 미치는 영향

Electronic components in an enclosure have been investigated to prevent undesired thermal problems. The electronic devices, such as ECUs of automotive engines, are operated under the contaminated environments, so that they rely on the passive cooling without any fluid-driving methods. Therefore the radiation heat dissipation plays more important role than the conduction and convection heat transfer. Hence their combined heat dissipation phenomena have been simulated by a numerical model to reveal the effects of supplied heat flux, emissivity of material, geometry of enclosure, charging gas and pressure. The result showed that the radiation had a significant effect on the heat dissipation of module in an enclosure, and some space above the module should be reserved to prevent its thermal problem. In addition, the higher thermal conductivity and pressure of gas in an enclosure could be necessary to improve the thermal dissipation from the electronic devices.