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반도체 공정시스템 개선을 위한 레이아웃 비교 연구

A Layout Comparison Study for Improving Semiconductor Fab System

  • 서정대 (경원대학교 산업정보시스템공학과)
  • Suh, Jung-Dae (Department of Industrial Engineering, Kyungwon University)
  • 발행 : 2009.05.31

초록

반도체 공정시스템의 레이아웃은 대규모 자본 투자의 필요성과 제조 공정의 복잡성의 증가와 함께 그 중요성이 점점 증가하고 있다. 오늘날 대부분의 반도체 공정시스템은 같은 유형의 장비가 동일한 bay에 배치되는 bay 타입의 레이아웃 형태를 취하고 있다. Bay 타입 레이아웃은 유연성의 장점을 가지고 있지만 물류 흐름의 제어 측면에서는 많은 단점을 가지고 있다. 본 논문에서는 이러한 bay 타입 레이아웃의 단점을 보완하고자 bay 타입의 유연성은 유지하되 conter spine이 없고 bay를 통합한 형태의 새로운 반도체 레이아웃 개념인 room 타입에 대해서 비교, 연구한다. 이를 위하여 본 논문에서는 새로운 room 타입 레이아웃의 형태를 제시하고 이를 기존의 레이아웃과 반송필요 횟수와 시간, foot-print, 경유 stocker, 그리고 물류흐름 시간 등의 성과척도를 비교하여 room 타입 레이아웃의 우수성을 보인다.

The importance of improving semiconductor fab layout has been increased with the necessity of a large-scale capital investment and the increase of manufacturing complexity of the system. For the present, most semiconductor fab takes the form of a bay type layout where the same types of machines has been laid at the same bay. The bay type layout has many disadvantages in respect of material flow control even though it has merits of flexibility. To overcome the drawbacks of the bay type layout, a new room type semiconductor layout which integrates bays without a center spine and maintains the flexibilities of the bay type has been presented and compared with existing layouts. The results of test show that the room type layout is superior to the existing layouts from standpoints of transportation number and time, foot-print, number of stocker being passed and material flow time.

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참고문헌

  1. Asef-Vaziri, A., Laporte, G., "Loop based facility planning and material handling,"European Journal of Operational Research, vol. 164, no. 1, pp.1-11, 2005. https://doi.org/10.1016/j.ejor.2004.01.037
  2. Campbell, E. and Amrnenheuser, J., "300 mm Factory Layout and Material Handling Modeling: Phase II Report," Technology Transfer # 99113848B-ENG International SEMATECH, 2001.
  3. Gaxilola, G. and Hennessy, L.,"Evaluation of Advantages of Integrating 300mm AMHS Fab Layouts In the Photo Area," IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings, pp. 373-376, 2001. https://doi.org/10.1109/ISSM.2001.962993
  4. Geiger C. D., Hase, R., Takoudis, C. G. and Uzsoy, R., "Alternative facility layouts for semiconductor wafer fabrication facilities," IEEE transactions on components, packing, and manufacturing technology-part C, vol 20, no 2, pp. 152-163, 1997. https://doi.org/10.1109/3476.622885
  5. Hase, R., Takoudis, C. G. and Uzsoy, R., "Cellular and reentrant layouts for semiconductor wafer fabrication facilities," IEEE/CPMT international electronics manufacturing technology symposium, pp. 112-118, 1994. https://doi.org/10.1109/IEMT.1994.404681
  6. Kurosaki, R., Nagao, N., Komada, H., Watanabe, Y. and Yano, H., "AMHS for 300 0101 wafer," Semiconductor Manufacturing Conference Proceedings, IEEE International Symposium on, D13-016, 1997.
  7. Lin, J. T., Wang, F. K. and Wu, C. K., "Connecting transport AMHS in a wafer fab," International Journal of Production Research, vol. 41, no. 3, pp. 529-544, 2003. https://doi.org/10.1080/0020754021000042418
  8. Pillai, D., Quinn T., Kryder, K., Charlson, D., "Integration of 300mm fab layouts and material handling automation," Semiconductor manufacturing conference proceedings, IEEE international symposium on, pp. 23-26, 1999. https://doi.org/10.1109/ISSM.1999.808729
  9. Quinn, T. and Bass, E., "300 mm factory layout and material handling modeling: phase I report", Technology Transfer # 99023688B-ENG, International SEMATECH, 1999.
  10. Schulz, M., Stanley, T. D., Renelt, B. and Sturm, R., "Simulation based decision support for future 300 MM automated material handling,"Proceedings of the Winter Simulation Conference, pp. 1518-1522, 2000.
  11. Ting, J. and Tanchoco, J. M. A., "Optimal Bidirectional Spine Layout for Overhead MHSs," IEEE Transactions on Semiconductor Manufacturing, vol. 14, no. 1, pp. 57-64, 2001. https://doi.org/10.1109/66.909655