The Journal of Korean Institute of Electromagnetic Engineering and Science (한국전자파학회논문지)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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Improved Characteristic of Radiated Emission of a PCB by Using the Via-Hole Position

단일 비아 위치를 이용한 PCB의 복사성 방사 성능 향상

  • Kim, Li-Jin (Department of Radio Science & Engineering, Chungnam National University) ;
  • Lee, Jae-Hyun (Department of Radio Science & Engineering, Chungnam National University)
  • Published : 2009.12.31
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Abstract

The cancellation method of P/G(power/ground) plane resonances which are generated between the power plane and the ground plane in a 4-layer PCB(Printed Circuit Boards) with a via-hole for the improvement of the RE(Radiated Emission) characteristic is presented. The validity of the proposed method was confirmed from simulation and measurement of performances of signal transmission characteristic, intensities of edge-radiation and radiated emission of PCB with a via-hole.

본 논문은 신호 전송용 비아가 있는 4층 PCB(Printed Circuit Boards)의 P/G(power/ground)면 사이에서 발생되는 공진을 상쇄시켜 복사성 방사(RE: Radiated Emission) 성능을 개선할 수 있는 기법을 제안하였다. 면간 공진 상쇄를 확인하기 위하여 비아가 있는 4층 PCB에서 신호 전송 선로의 전송 특성, PCB 개방 모서리를 통한 방사(radiation)와 RE 세기를 계산하고, 측정하여 제안된 기법의 타당성을 입증하였다.

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References

  1. Jun So Pak, Jing Ook Kim, Jung Gun Byun, Hee Jae Lee, and Joung Ho Kim, 'Coupling of through- hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB', Proc. IEEE Int. Symp. Electromag. Compat., vol. 1, pp. 231-235, Aug. 2003
  2. Jun So Pak, Masahiro Aoyagi, Katsuya Kikuchi, and Joung Ho Kim, 'Band-stop filter effect of power/ ground plane on through-hole signal via in multilayer PCB', IEICE Trans. Electron., vol. E89-C, no. 4, Apr. 2006
  3. Jun So Pak, Hyung Soo Kim, Jun Woo Lee, and Joung Ho Kim, 'Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model', IEEE Trans. on Advanced Packaging, vol. 30, no. 1, Feb. 2007
  4. Li-Jin Kim, Su-Han Kim, and Jae-Hyun Lee, 'Variation of the dembedding via-hole discontinuity due to the resonance of power/ground plane', Asia-Pacific Microwave Conference, Sec. J5, Dec. 2008
  5. David M. Porza, Microwave Engineering 3rd Edition, New York: Wiley-Intersciences, pp. 278-282, 2005
  6. T. Okoshi, Planar Circuits for Microwaves and Lightwaves, Berlin, Germany: Springer-Verlag, 1985

Cited by

  1. Study of SI Characteristic of Multilayer PCB with a Through-Hole Via vol.21, pp.2, 2010, https://doi.org/10.5515/KJKIEES.2010.21.2.188