DRIE Technology for TSV Fabrication

TSV 형성을 위한 DRIE 기술

  • 백규하 (한국전자통신연구원 RFID/USN 연구부) ;
  • 김동표 (한국전자통신연구원 RFID/USN 연구부) ;
  • 박건석 (한국전자통신연구원 RFID/USN 연구부) ;
  • 강진영 (한국전자통신연구원 RFID/USN 연구부) ;
  • 이기준 (충남대학교 전자공학과) ;
  • 도이미 (한국전자통신연구원 RFID/USN 연구부)
  • Published : 2009.12.01

Abstract

Keywords

References

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