References
- W. W. Lee and P. S. Ho, 'Low dielectric constant materials for ULSI interlayer dielectric applications', MRS Bulletin, Vol. 22, No. 10, p. 19, 1997 https://doi.org/10.1557/S0883769400034692
- S. P. Muraka, 'Low dielectric constant materials for interlayer dielectric applications', Solid State Technology, Vol. 39, No. 3, p. 34, 1996
- C. H. Ting and T. E. Seidel, 'Methods and needs for low-k material research', Mat. Res. Symp. Proc., Vol. 381, p. 3, 1995 https://doi.org/10.1557/PROC-381-3
- Y. H. Kim, S.-K. Lee, and H. J. Kim, 'Low-k Si-O-C-H composite films prepared by plasma-enhanced chemical vapor deposition using bis-trimethylsilymethane precursor', J. Vac. Sci. Tech. A, Vol. 18(4), Part 2, p. 1216, 2000 https://doi.org/10.1116/1.582328
- Y. H. Kim, 'Deposition and characterization of low-dielectric-constant SiOCH thin films for interlayer dielectrics of multilevel interconnection', Ph.D. Dissertation, Seoul National University, 2002
-
Nara, A. and Itoh, H., 'Low dielectric constant insulator formed by downstream plasma CVD at room temperature using TMS/
$O_2$ ', Jpn. J. Appl. Phys., Vol. 36, p. 1477, 1997 https://doi.org/10.1143/JJAP.36.1477 - Grill, A. and Patel, V., 'Low dielectric constant SiCOH films as potential cadidates for interconnect dielectrics', Mat. Res. Soc. Symp. Proc., Vol. 565, p. 107, 1999 https://doi.org/10.1557/PROC-565-107
- T. Oh and H. B. Kim, 'Properties of organic thin-flim transistors on hybrid-type interlayer dielectric materials', J. of Korean Physical Society, Vol. 49, p. 865, 2005
- Grill, A. and Deborah A, 'Structure of low dielectric constant to extreme low dielectric constant SiOCH films : Fourier transform ingrared spectroscopy characterization', Journal of Applied Physics, Vol. 94, No. 10, p. 6697, 2003 https://doi.org/10.1063/1.1618358
-
J. W. Kim, C. S. Hwang, and H. B. Kim, 'Properties of SiOCH thin film bonding mode by BTMSM/
$O_2$ flow rates', J. of KIEEME (in Korean), Vol. 21, No. 4, p. 354, 2008 https://doi.org/10.4313/JKEM.2008.21.4.354 - Grill, A., Perraud, L., Patel, V., Jahnes, C., and Cohen, S., 'Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition', Applied Physics Letters, Vol. 79, p. 803, 2001 https://doi.org/10.1063/1.1392976
- A. Grill, 'Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-k to extreme low-k interconnect materials', J. of Applied Physics, Vol. 93, p. 1785, 2003 https://doi.org/10.1063/1.1534628
- I. H. Yi, C. S. Hwang, and H. B. Kim, 'A study of the dielectric characteristics of the low-k SiOCH thin films', J. of KIEEME(in Korean), Vol. 21, No. 12, p. 1083, 2008 https://doi.org/10.4313/JKEM.2008.21.12.1083
- S. Y. Jing, H.-J. Lee, and C. K. Choi, 'Chemical bond structure on Si-O-C composite films with a low dielectric constant deposited by using inductively coupled plasma chemical vapor deposition', J. of Korean Physical Society, Vol. 41, p. 769, 2002
-
Oh, T., Kim, H. S., Oh, S. B., and Won, M. S., 'Chemical shift determined according to flow rate ration
$O_2$ . BTMSM by fourier transform infrared spectra and x-ray photoelectron spectroscopy', Jpn. J. Appl. Phys., Vol. 42, p. 6292, 2003 https://doi.org/10.1143/JJAP.42.6292