전도성 실버 페이스트의 미세구조 발달에 미치는 glass-frit 크기의 영향

Influence of Glass-Frit Size on the Microstructural Evolution of Conductive Silver Paste

  • 한현근 (조선대학교 신소재공학과) ;
  • 서동석 (조선대학교 신소재공학과) ;
  • 이종국 (조선대학교 신소재공학과)
  • Han, Hyun Geun (Department of Advanced Materials Engineering, Chosun University) ;
  • Seo, Dong Seok (Department of Advanced Materials Engineering, Chosun University) ;
  • Lee, Jong Kook (Department of Advanced Materials Engineering, Chosun University)
  • 투고 : 2008.04.03
  • 발행 : 2008.08.25

초록

The effect of glass-frit size on microstructural evolution and electrical resistance of conductive silver paste was investigated. Silver paste was prepared by mixing 70 wt% commercial silver powder with $1.6{\mu}m$, 3 wt% Bi based glass-frit and 27 wt% organic vehicle. Two different sizes of glass-frit were obtained by ball-milling of commercial glass-frit ($3{\mu}m$) for 3 and 5 days, which had an average particle size of 1.0 and $0.5{\mu}m$. The smaller glass-frit was melt at low sintered temperature and rapidly spread between the silver particles, which is induced the dense networking among silver particles and strong adhesiveness to $Al_2O_3$ substrate. The silver film with smaller glass-frit sintered at $500^{\circ}C$ showed the small pore size and low porosity resulting in low electrical resistivity of $4{\mu}{\Omega}cm$.

키워드

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