References
- Masuzawa, T., "State of the Art of Micromachining," Annals of the CIRP, Vol. 49, No. 2, pp. 473-488, 2000 https://doi.org/10.1016/S0007-8506(07)63451-9
- Pham, D. T., Dimov, S. S., Bigot, S., Ivanov, A. and Popov, K., "Micro-EDM - Recent Developments and Research Issues," Journal of Materials Processing Technology, Vol. 149, Issues 1-3, pp. 50-57, 2004 https://doi.org/10.1016/j.jmatprotec.2004.02.008
- Kim, Y. T., Park, S. J. and Lee, S. J., "Micro/Meso-Scale Shapes Machining by Micro EDM Process," International Journal of Precision Engineering and Manufacturing, Vol. 6, No. 2, pp. 5-11, 2005
- Lim, J. H., Je, S. J., Ryu, S. H. and Chu, C. N., "Distortion of the Bottom Surface in Micro Cavity Machining Using MEDM," International Journal of Precision Engineering and Manufacturing, Vol. 6, No. 4, pp. 44-48, 2005
- Lim, H. S., Wong, Y. S., Rahman, M. and Lee, M. K. E., "A study on the machining of high-aspect ratio micro-structures using micro-EDM," Journal of Materials Processing Technology, Vol. 140, Issues 1-3, pp. 318-325, 2003 https://doi.org/10.1016/S0924-0136(03)00760-X
- Takahata, K., Shibaike, N.and Guckel, H., "High-Aspect-Ratio WC-Co Microstructure Produced by the Combination of LIGA and Micro-EDM," Microsystem Technologies, Vol. 6, No. 5, pp. 1432-1858, 2000
- Hunter, I. W., Lafontaine, S. R. and Madden, J. D., "Three-Dimensional Microfabrication by Localized Electrochemical Deposition and Etching," US Patent, No. 5641391, 1997
- Madden, J. D. and Hunter, I. W., "Three-Dimensional Micro-Fabrication by Localized Electrochemical Deposition," Journal of Microelectromechanical Systems, Vol. 5, Issue 1, pp. 24-32, 1996 https://doi.org/10.1109/84.485212
- Jansson, A., Thornell, G. and Johansson, S., "High Resolution 3D Microstructures Made by Localized Electrodeposition of Nickel," Journal of the Electrochemical Society, Vol. 147, Issue 5, pp. 1810-1827, 2000 https://doi.org/10.1149/1.1393439
- El-Giar, E. M. and Thomson, D. J., "Localized Electrochemical Plating of Interconnectors for Microelectronics," Proceedings of IEEE Conference on Communications, Power and Computing, WESCANEX, pp. 327-332, 1997
- El-Giar, E. M., Said, R. A., Bridges, G. E. and Thomson, D. J., "Localized Electrochemical Deposition of Copper Microstructures," Journal of the Electrochemical Society, Vol. 147, Issue 2, pp. 586-591, 2000 https://doi.org/10.1149/1.1393237
- Park, J. W., Ryu, S. H. and Chu, C. N., "Pulsed Electrochemical Deposition for 3D Micro Structuring," International Journal of Precision Engineering and Manufacturing, Vol. 6, No. 4, pp. 49-54, 2005
- Yeo, S. H. and Choo, J. H., "Effects of Rotor Electrode in the Fabrication of High Aspect Ratio Microstructures by Localized Electrochemical Deposition," Journal of Micromechanics and Microengineering, Vol. 11, No. 5, pp. 435-442, 20018 https://doi.org/10.1088/0960-1317/11/5/301