Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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The Selection on the Optimal Condition of Si-wafer final Polishing by Combined Taguchi Method and Respond Surface Method

실험계획법을 적용한 웨이퍼 폴리싱의 최적 조건 선정에 관한 연구

  • 원종구 (인하대학교 기계공학과 대학원) ;
  • 이정훈 (인하대학교 기계공학과 대학원) ;
  • 이정택 (인하대학교 기계공학과 대학원) ;
  • 이은상 (인하대 기계공학과)
  • Published : 2008.02.15
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Abstract

The final polishing process is based on slurry, pad, conditioner, equipment. Therefore, the concept of wafer final polishing is also necessary for repeatability of results between polished wafers. In this study, the machining conditions have a pressure, table speed, machining time and slurry ratio. This research investigated the surface characteristics that apply variable machining conditions and response surface methodology was used to obtain more flexible and optimumal condition base on Taguchi method. On the base of estimated response surface curvature from the equation and results of Taguchi method, combined design of experiment was considered to lead to optimumal condition. Finally, polished wafer was obtained mirror like surface.

Keywords

References

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