Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Line Length Effect on Electromigration Characteristics of Eutectic SnPb Solder

공정 조성 SnPb 솔더의 배선 길이에 따른 electromigration 특성

  • Lee, Yong-Duk (School of Materials Science and Engineering, Andong National University) ;
  • Lee, Jang-Hee (School of Materials Science and Engineering, Andong National University) ;
  • Yoon, Min-Seung (School of Materials Science and Engineering, Seoul National University) ;
  • Joo, Young-Chang (School of Materials Science and Engineering, Seoul National University) ;
  • Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
  • 이용덕 (안동대학교 신소재공학부) ;
  • 이장희 (안동대학교 신소재공학부) ;
  • 윤민승 (서울대학교 재료공학부) ;
  • 주영창 (서울대학교 재료공학부) ;
  • 박영배 (안동대학교 신소재공학부)
  • Published : 2007.07.27
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Abstract

In-situ observation of electromigration behavior of eutectic SnPb solder was performed as a function of line length at $100^{\circ}C$, $6{\times}10^4A/cm$ condition in a scanning electron microscope chamber. The incubation time for edge drift and the edge drift velocity increase as line length increases, which are discussed with the void nucleation stage of solder bump and the electromigration back flux force, respectively. Finally, the existence of electromigration product (jL) and its line length dependency are also discussed.

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References

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