Fabrication of Polymeric Optical Fiber Array

정밀 고분자 광섬유 어레이 제작 연구

  • 조상욱 (부산대학교 나노과학기술대학) ;
  • 정명영 (부산대학교 나노과학기술대학) ;
  • 김창석 (부산대학교 나노과학기술대학) ;
  • 안승호 (한국전자통신연구원)
  • Published : 2007.05.01

Abstract

This work is to fabricate a precise optical fiber array using polymer composite for optical interconnection. Optical fiber array has to satisfy low optical loss requirement less than 0.4 dB according to temperature change. For this purpose, design criteria for an optical fiber array was derived. The coefficient of thermal expansion of silica particulate epoxy composites was affected by volume fraction of silica particles. And also, elastic modulus of silica particulate epoxy composites was affected by volume fraction of silica particles. To obtain the coefficients of thermal expansion below $10{\times}10E-6/^{\circ}C$ and elastic modulus more than 20 GPa , we chose the volume fraction more than 76%. Using silica particulate epoxy composites with the volume fraction 76%, 8-channel optical fiber array with dimensional tolerances below $1\;{\mu}m$ was manufactured by transfer molding technique using dies with the uniquely-designed core pin and precisely-machined zirconia ceramic V block. These optical fiber arrays showed optical loss variations within 0.4 dB under thermal cycling test and high temperature test.

Keywords

References

  1. Nagase, R., 'Recent Progress on Optical Fiber Connectors for Telecommunication Systems,' OECC 2003, pp. 117-118, 2003
  2. De Rosa, M., Carberry, J., Bhagavatula, V., Wagner, K. and Saravanos, C., 'High-power performance of single-mode fiber-optic connectors,' J. Lightwave Technol., Vol. 20, No. 5, pp. 879-885, 2002 https://doi.org/10.1109/JLT.2002.1007944
  3. Van Zantvoort, J. H. C., Plukker, S. G. L., Dekkers, E. C. A., Khoe, G. D., Koonen, A. M. J. and De Waardt, H., 'Laser Supported Fibre Array Alignment with Individual Fibre Fine Positioning,' ECTC 2005, pp. 266-271, 2005 https://doi.org/10.1109/ECTC.2005.1441277
  4. Shin, D. K. and Lee, J. J., 'A Study on the Mechanical Behavior of EMC and Thermal Stress Analysis in Plastic Packaging,' Advances in Electronic Packaging, Vol. 1, No.1, pp. 253-259, 1997
  5. Nielsen, L. E. and Lewis, T. B., 'Temperature Dependence of Relative Modulus in Filled Polymer Systems,' Journal of Polymer Science: Part A-2, Vol. 7, No. 10, pp. 1705-1719, 1969 https://doi.org/10.1002/pol.1969.160071007