참고문헌
- T. Tori., 'Gate Dielectrics and MOS ULSIs,' (Springer, New York. 1997)
- G. D. Wilk, R. M. Wallace, J. M. Anthony, 'High- gate dielectrics: Current status and materials properties considerations,' J. Appl. Phys., Vol.89, No.10, pp.52435275 (2001) https://doi.org/10.1063/1.1361065
- Byoung Hun Lee, Yongjoo Jeon, Keith Zawadzki, Wen-Jie Qi and Jack C. Lee, 'Effect of interfacial layer growth on the electrical characteristics of thin titanium oxide films on silicon,' Appl. Phys. Lett. 74, 3143, 1999 https://doi.org/10.1063/1.124089
- H. Kim, D. C Gilmer, S. A. Campbell, and D. L. Polla, 'Leakage current and electrical breakdown in metal-organic chemical vapor deposited TiO2 dielectric on silicon substrates,' Appl. Phys. Lett. 69, p.3860, 1996 https://doi.org/10.1063/1.117129
- R. Nieh, S. Krishnan, J. Cho, C. Kang, S. Gopalan, K. Onishi, R. Choi, and Jack C. Lee, 'Comparison between ultra-thin ZrO2 and ZrOxNy gate dielectrics in TaN or poly-gated nMOSCAP and nMOSFET devices,' 2002 VLSI Symposium Dig., p186, 2002 https://doi.org/10.1109/VLSIT.2002.1015445
- S. B. Chen, C. H. Lai and Albert Chin, 'High-density MIM capacitor using Al2O3 and AlTiOx dielectrics,' IEEE Electron Device Lett., Vol 23, No.4, 185, April (2002) https://doi.org/10.1109/55.992833
-
A. Ono, K. Fukasaku, T. Fukuda, N. Ilezaw, K. Imai, and T. Horiuchu, 'A
$70 :\{\mu}mGate$ Length CMOS technology with 1.0 V Operation,' Technical Digest of Symposium on VLSI Technology, p. 14, 2000 https://doi.org/10.1109/VLSIT.2000.852750 - B. H. Lee, 'Technology development and process integration of alternative gate dielectric material; Hafnium oxide,' Ph. D. dissertation, The university of Texas at Austin, 2000
- K. J. Hubbard and D. G. Schlom, 'Thermodynamic Approach to Selecting Alternative Gate Dielectrics,' The Materials Research Society Bulletin, vol. 27(3), p.198, 2002
- Hang Hu Chunxiang Zhu, 'Physical and electrical characterization of HfO2 metal -insulator-metal capacitors for Si analog circuit application,' J. Appl. Phys., Vol. 94, Jul.1, pp.551-557 (2003) https://doi.org/10.1063/1.1579550
- J. S. Kim, H. J. Lee, K. S. Kim, J. E. Lee, Y. Roh, Y. S. Jung and C. W. Yang, 'Characteristics of high-k gate oxides prepared by oxidation of 1.4 nm multi-layered Hf/Al metal film,' Thin Solid Films, Volume 515, Issue 2, 25, October 2006, Pages 517-521 https://doi.org/10.1016/j.tsf.2005.12.286
- F. Fillot, B. Chenevier, S. Maitrejean, M. Audier, P. Chaudouet, B. Bochu, J. P. Senateur, A. Pisch, T. Mourier, H. Monchoix et al., 'Investigations of the interface stability in HfO2?8metal electrodes,' Microelectronic Engineering, Volume 70, Issues 2-4, Nov. 2003, Pages 384-391 https://doi.org/10.1016/S0167-9317(03)00428-3
- Kaupo Kukli, Mikko Ratala, Timo Sajavaara, Juhani Keinonen, and Markku Leskela, 'Atomic Layer Deposition of Hafnium Dioxide Films from Hafnium Tetrakis(ethylmethylamide) and Water,' Chem. Vap. Deposition 2002, 8, No. 5 https://doi.org/10.1002/1521-3862(20020903)8:5<199::AID-CVDE199>3.0.CO;2-U
- G. He, Q. Fang, M. Liu, L. Q. Zhu, L. D. Zhang, 'The structural and interfacial properties of HfO2/Si by the plasma oxidation of sputtered metallic Hf thin films,' Journal of Crystal Growth, 268, (2004), 155-162 https://doi.org/10.1016/j.jcrysgro.2004.05.038
- M.-H. Cho, Y. S. Roh, C.N. Whang, and K. Jeong, S. W. Nahm, D. -H. Ko, J. H. Lee, N. I. Lee, and K. Fujihara, 'Thermal stability and structural characteristics of HfO2 films on Si(100) grown by atomic layer deposition,' Applied Physics Letters, Vol 81, No 3 https://doi.org/10.1063/1.1487923
-
Suheun Nam, Seok-Woo Nam, Jung-Ho Yoo, Dae-Hong Ko, 'Interface control by modified sputtering on
$Pt/HfO_2/Si$ system,', Materials Science and Engineering, B102, (2003), 123-127 https://doi.org/10.1016/S0921-5107(03)00017-5