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The Structural and Electrical Properties of Bismuth-based Pyrochlore Thin Films for embedded Capacitor Applications

  • Ahn, Kyeong-Chan (Department of Nano information Systems Engineering, Chungnam National University) ;
  • Park, Jong-Hyun (Department of Nano information Systems Engineering, Chungnam National University) ;
  • Ahn, Jun-Ku (Department of Nano information Systems Engineering, Chungnam National University) ;
  • Yoon, Soon-Gil (Department of Nano information Systems Engineering, Chungnam National University)
  • 발행 : 2007.04.01

초록

[ $Bi_{1.5}Zn_{1.0}Nb_{1.5}O_7$ ] (BZN), $Bi_2Mg_{2/3}Nb_{4/3}O_7$ (BMN), and $Bi_2Cu_{2/3}Nb_{4/3}O_7$ (BCN) pyrochlore thin films were prepared on $Cu/Ti/SiO_2/Si$ substrates by pulsed laser deposition and the micro-structural and electrical properties were characterized for embedded capacitor applications. The BZN, BMN, and BCN films deposited at $25\;^{\circ}C$ and $150\;^{\circ}C$, respectively show smooth surface morphologies and dielectric constants of about $39\;{\sim}\;58$. The high dielectric loss of the films deposited at $150\;^{\circ}C$ compared with films deposited at $25\;^{\circ}C$ was attributed to the defects existing at interface between the films and copper electrode by an oxidation of copper bottom electrode. The leakage current densities and breakdown voltages in 200 nm thick-BMN and BZN films deposited at $150\;^{\circ}C$ are approximately $2.5\;{\times}\;10^{-8}\;A/cm^2$ at 3 V and above 10 V, respectively. Both BZN and BMN films are considered to be suitable materials for embedded capacitor applications.

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참고문헌

  1. Y. Rao, S. Ogitani, P. Kohl, and C. P. Wong, 'Novel high-dielectric constant nano-structure polymer-ceramic composite for embedded capacitor application', Proc. ECTC., Vol. 183, p. 183,2000
  2. S. Ramesh, B. A. Shutzberg, C. Huang, J. Gao, and E. P. Giannelis, 'Dielectric nanocomposites for integral thin film capacitors: Materials design, fabrication and integration issues', IEEE Trans. Adv. Packaging, Vol. 26, No.1, p. 17,2003 https://doi.org/10.1109/TADVP.2003.811365
  3. D. G. Weiss, 'Changes in the PCB world with new packaging technologies and the integration of passive components into the PCB', Circuit World, Vol. 24, No.2, p. 6, 1998
  4. H. Pohl, 'Superdielectrics polymers', IEEE Trans. Electrical Insulation, Vol. EI 21, No.5, p. 683, 1986
  5. G. M. Safronov, V. N. Batag, T. V. Stepanyuk, and P. M. Fedorov, 'Equilibrium diagram of bismuth oxide-zinc oxide system', Russ. J. Inorg. Chem., Vol. 16, p. 460, 1971
  6. D. P. Cann, C. A. Randall, and T. R. Shrout, 'Investigation of the dielectric properties of bismuth pyrochlores', Solid State Commun., Vol. 100, p. 529, 1996
  7. J. Lu and S. Stemmer, 'Low-loss, tunable bismuth zinc niobate films deposited by RF magnetron sputtering', Appl. Phys. Lett., Vol. 83, p. 2411, 2003 https://doi.org/10.1063/1.1613036
  8. S. W. Wang, W. Lu, N. Li, Z. F. Li, H. Wang, M. Wang, and X. C. Shen, 'Insulating properties of rapid thermally processed $Bi_{2}Ti_{2}O_{7}$thin films by a chemical solution decomposition technique', Mater. Res. Bull., Vol. 37, p. 1691,2002
  9. J. H. Park, W. S. Lee, N. J. Seong, S. G. Yoon, S. H Son, H. M. Chung, J. S. Moon, H. J. Jin, S. E. Lee, J. W. Lee, H. D. Kang, Y. K. Chung, and Y. S. Oh, 'Bismuth-zinc-niobate embedded capacitors grown at room temperature for printed circuit board applications', Appl. Phys. Lett., Vol. 88, p. 192902, 2006 https://doi.org/10.1063/1.2202129
  10. J. H. Park, C. J. Xian, N. J. Seong, S. G. Yoon, S. H Son, H. M. Chung, J. S. Moon, H. J. Jin, S. E. Lee, J. W. Lee, H. D. Kang, and Y. K. Chung, 'Bismuthbased pyrochlore thin films deposited at low temperatures for embedded capacitor applications', Jpn. J. of Applied Physics part 1, Vol. 45, p. 7325, 2006 https://doi.org/10.1143/JJAP.45.7325
  11. J. H. Park, C. J. Xian, N. J. Seong, S. G. Yo on, S. H Son, H. M. Chung, J. S. Moon, H. J. Jin, S. E. Lee, J. W. Lee, H. D. Kang, Y. K. Chung, and Y. S. Oh, 'Realization of a high capacitance density in $Bi_{2}Mg_{2/3}Nb_{4/3}O_{7}$pyrochlore thin films deposited directly on polymer substrates for embedded capacitor applications', Appl. Phys. Lett., Vol. 89, No. 23,p. 232910,2006 https://doi.org/10.1063/1.2402896
  12. T. Kim, A. I. Kingon, J. P. Maria, and R. T. Croswell, 'Ca-doped lead zirxonate titanate thin film capacitors on base metal nickel on copper foil', J. Mater. Res., Vol. 19, No. 10, p. 2841, 2004 https://doi.org/10.1557/JMR.2004.0387
  13. C. J. Xian, J. H. Park, K. C. Ahn, S. G. Yoon, J. W. Lee, W. C. Kim, S. T. Lim, S. H. Sohn, J. S. Moon, H. M. Jung, S. E. Lee, I. H. Lee, Y. K. Chung, M. K. Jean, and S. I. Woo, 'Electrical properties of $Bi_{2}Mg_{2/3}Nb_{4/3}O_{7}$(BMN) pyrochlore thin films deposited on Pt and Cu metal at low temperatures for embedded capacitor applications', Appl. Phys. Lett., Vol. 90, p. 052903, 2007 https://doi.org/10.1063/1.2435336