Polymer(Korea) (폴리머)

The Polymer Society of Korea (한국고분자학회)
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Preparation and Thermo-Mechanical Properties of 4-Component Polyimide Films

4성분계 폴리이미드 필름 제조 및 열적-기계적 특성

  • Seo, Kwan-Sik (Polymeric Nanomaterials Lab., Korea Research Institute of Chemical Technology) ;
  • Sul, Kyung-Il (Polymeric Nanomaterials Lab., Korea Research Institute of Chemical Technology) ;
  • Kim, Yong-Seok (Polymeric Nanomaterials Lab., Korea Research Institute of Chemical Technology) ;
  • Suh, Dong-Hack (Department of Chemical Engineering, Hanyang University) ;
  • Choi, Kil-Young (Polymeric Nanomaterials Lab., Korea Research Institute of Chemical Technology) ;
  • Won, Jong-Chan (Polymeric Nanomaterials Lab., Korea Research Institute of Chemical Technology)
  • 서관식 (한국화학연구원 고분자나노소재연구팀) ;
  • 설경일 (한국화학연구원 고분자나노소재연구팀) ;
  • 김용석 (한국화학연구원 고분자나노소재연구팀) ;
  • 서동학 (한양대학교 화학공학과) ;
  • 최길영 (한국화학연구원 고분자나노소재연구팀) ;
  • 원종찬 (한국화학연구원 고분자나노소재연구팀)
  • Published : 2007.03.31
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Abstract

To enhance the thermo-mechanical properties of polyimide films which have potential application for the FCCL, we have synthesized the poly (amic acid) s composed of 4-components PMDA/BTDA and PDA/ODA as monomer system, u4 then they were effectively converted into 4-component polyimide films by thermal imidization process. It has been found that CTE values in the range of $100\sim200^{\circ}C$ decreased with the amount of PDA, which also caused 36% and 59% increases in tensile modulus and strength respectively. And also, peel test results on 3-layered copper clad laminate using 4-component polyimide films showed excellent adhesion strength above 1.8 kgf/cm. On the basis of obtained results it can be concluded that 4-component polyimide films may be applied for the high performance FCCL base films.

Flexible copper clad laminate(FCCL) 적용을 위한 폴리이미드 필름의 열적-기계적 성질 향상을 위해, 4성분계 PMDA/BTDA 그리고 PDA/ODA 단량체로부터 폴리아믹산을 합성하였고, 이를 효과적으로 열적 이미드화 공정을 통하여 4성분계 폴리이미드 필름을 제조하였다. 4성분계 폴리이미드 필름의 CTE 값은 $100\sim200^{\circ}C$ 범위에서 PDA의 함량에 따라 감소하였고, 인장 계수와 인장 강도는 36% 그리고 59% 각각 증가하였다. 그리고 4성분계 폴리이미드 필름을 사용한 3층 유연성 기판의 peel test 결과는 1.8 kgf/cm 이상의 좋은 접착 강도를 보였다. 이와 같은 결과들로부터 4성분계 폴리이미드 필름은 고성능 FCCL을 위한 기본 필름으로 적용할 수 있다.

Keywords

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