Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
권호 표지
DOI QR코드

DOI QR Code

Consolidation and Characterization of Cu-based Bulk Metallic Glass Composites

Cu기 벌크 비정질 복합체의 성형 및 특성

  • Lee, Jin-Kyu (Advanced Materials Division, Korea Institute of Industrial Technology) ;
  • Kim, Taek-Soo (Advanced Materials Division, Korea Institute of Industrial Technology)
  • 이진규 (한국생산기술연구원 신소재본부) ;
  • 김택수 (한국생산기술연구원 신소재본부)
  • Published : 2007.12.28
Download PDF
⟨ Previous Next ⟩

Abstract

The Cu-based bulk metallic glass (BMG) composite was fabricated by spark plasma sintering (SPS) using of gas-atomized metallic glass powders and ductile brass powders. No defect such as pores and cavities was observed at the interface between the brass powder and the metallic glass matrix, suggesting that the SPS process caused a severe viscous flow of the metallic glass and brass phases in the supercooled liquid region, resulting in a full densification. The BMG composites shows some macroscopic plasticity after yielding, although the levels of strength decreased.

Keywords

References

  1. A. Inoue: Acta Mater., 48 (2000) 279 https://doi.org/10.1016/S1359-6454(99)00300-6
  2. A. L. Greer and E. Ma: MRS Bulletin, 32 (2007) 611 https://doi.org/10.1557/mrs2007.121
  3. D. H. Bae, M. H. Lee, S.Yi, D. H. Kim and D. J. Sordelet: J. Non-Cryst Solids, 337 (2004) 15 https://doi.org/10.1016/j.jnoncrysol.2004.03.107
  4. D. H. Bae, M. H. Lee, D. H. Kim and D. J. Sordelet: Appl. Phys. Lett., 83 (2003) 2312 https://doi.org/10.1063/1.1611622
  5. S. Venkataraman, E. Rozhkova, J. Eckert, L. Schultz and D. J. Sordelet: Intermetallics, 13 (2005) 833 https://doi.org/10.1016/j.intermet.2005.01.010
  6. P. Y. Lee, M. C. Kao, C. K. Lin and J. C. Huang: Intermetallics, 14 (2006) 994 https://doi.org/10.1016/j.intermet.2006.01.023
  7. M. H. Lee, D. H. Bae, W. T. Kim, D. H. Kim, E. Rozhkova, P. B. Wheelock and D. J. Sordelet: J. Non-Cryst Solids, 315 (2003) 89 https://doi.org/10.1016/S0022-3093(02)01424-2
  8. J. K. Lee, H. J. Kim, T. S. Kim, S. Y. Shin, Y. C. Kim and J. C. Bae: J. Mater. Process. Tech., 187-188 (2007) 801 https://doi.org/10.1016/j.jmatprotec.2006.11.206
  9. C. C. Hays, C. P. Kim and W. L. Johnson: Phys. Rev. Lett., 84 (2000) 2901 https://doi.org/10.1103/PhysRevLett.84.2901
  10. H. Choi-Yim and W. L. Johnson: Appl. Phys. Lett., 50 (2002) 2737