International Journal of Safety

한국안전학회 (The Korean Society of Safety)
권호 표지

Friction and Wear Simulation of Suspended Silicon Asperity Moving over a Plate at Microscale

  • Cho, Sung-San (Department of Mechanical & System Design Engineering, Hongik University) ;
  • Kim, Jung-Soo (Department of Mechanical & System Design Engineering, Hongik University) ;
  • Park, Seung-Ho (Department of Mechanical & System Design Engineering, Hongik University)
  • 발행 : 2006.06.30
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초록

A suspended hemispherical silicon asperity moving over a silicon plate was simulated. The simulation results on friction and wear in the interface between the two can help obtain more durable miscroscale structures. Silicon structures were constructed with Tersoff three-body potential. Dependence of friction and wear of the asperity on both the atomic arrangement in the plate and the moving direction was investigated under the condition that the asperity is subject to the attractive normal force due to the plate. The results show that the variation of friction force with the movement of asperity, and the occurrence of adhesive wear are attributed to the formation and rupture of asperity, junction between the asperity and the plate. The friction force and wear are smaller when the asperity is incommensurate with the plate, and they also depend on the moving direction of the asperity over the plate.

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