Thermal Behavior of Hwangto and Wood Flour Reinforced High Density Polyethylene (HDPE) Composites

  • Lee, Sun-Young (Laboratory of Functional Wooden Materials Department of Forest Products Korea Forest Research Institute) ;
  • Doh, Geum-Hyun (Laboratory of Functional Wooden Materials Department of Forest Products Korea Forest Research Institute) ;
  • Kang, In-Aeh (Laboratory of Functional Wooden Materials Department of Forest Products Korea Forest Research Institute)
  • Received : 2006.05.25
  • Accepted : 2006.07.26
  • Published : 2006.09.25

Abstract

The thermal properties of wood flour, Hwangto, and maleated polyethylene (MAPE) reinforced HDPE composites were investigated in this study. The thermal behavior of reinforced wood polymer composites was characterized by means of thermogravimetric (TGA) and differential scanning calorimetric (DSC) analyses. Hwangto and MAPE were used as an inorganic filler and a coupling agent, respectively. According to TGA analysis, the increase of wood flour level increased the thermal degradation of composites in the early stage, but decreased in the late stage. On the other hand, Hwangto reinforced composites showed the higher thermal stability than virgin HDPE, from the determination of differential peak temperature ($DT_p$). Decomposition temperature of wood flour and/or Hwangto reinforced composites increased with increase of heating rate. From DSC analysis, melting temperature of reinforced composites little bit increased with the addition of wood flour or Hwangto. As the loading of wood flour or Hwangto to HDPE increased, overall enthalpy decreased. It showed that wood flour and Hwangto absorbed more heat energy for melting the reinforced composites. Hwangto reinforced composites required more heat energy than wood flour reinforced composites and virgin HDPE. Coupling agent gave no significant effect on the thermal properties of composites. Thermal analyses indicate that composites with Hwangto are more thermally stable than those without Hwangto.

Keywords

References

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