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Fabrication of $CeO_2$ Buffer Layer Using MOD Process

  • Published : 2006.11.30

Abstract

Biaxially textured Ni was fabricated by electrodeposition process and delaminated from the biaxially textured cathode surface for further buffer layer deposition process. Those electrode posited Ni substrates showed well-developed biaxial texture and smooth surface. In order to improve the thermal stability of Ni substrates, Mn was alloyed by adding Mn precursor into the electrodeposition bath. Subsequently, $CeO_2$ buffer layers are deposited by MOD process to prevent interfacial reaction between superconductor and substrates. In particular, Bismuth oxide was added to $CeO_2$ to realize lower temperature processing of buffer layers. The microstructure and texture development of each layers have been investigated. Preliminary results shows that all electro/chemical process can be a candidate for cost effective route to YBCO coated conductor.

Keywords

References

  1. D. T. Dawley, P. G. Clem, M. P. Siegal, O. L. Overmeyer, M. A. Rodriguez, 'Thick sol-gel derived $YBa_2Cu_3O{7-x}$ films,' IEEE Trans. Appl. Supercond. vol. 11, pp. 2873-2876, 2001 https://doi.org/10.1109/77.919662
  2. D. Verebelyi, U. Schoop, C. Thieme, X. Li, X. Zhang, T. Kodenkandath, A. P. Malozemoff, P. Nguyen, V. E. Siegal, D. Buczek, 'Uniform performance of continuously processed MOD-YBCO-coated conductors using a textured Ni-W substrate,', Supercond. Sci. and Tech., vol. 16, pp. L19-L22, 2003 https://doi.org/10.1088/0953-2048/16/1/304
  3. S. Miura, K. Hashimoto, F. Wang, Y. Enomoto, T. Morishita, 'Structural and electrical properties of liquid phase epitaxially grown $YBa_2Cu_3O_x$ films,' Physic C, vol. 278, pp. 201-206, 1997 https://doi.org/10.1016/S0921-4534(97)00127-5
  4. J. M. Yoo, Y. K. Kim, K. C. Chung, J. W. Ko, H. Chung, K. Marken, 'Electrodeposition of biaxially textured metal tape with low magnetic hysteresis loss for coated conductor application,' presented at the 6th Pac Rim Conf. on Ceram. and Glass Tech., Maui, USA 2005
  5. A.A. Talin, E.A. Marquis, S.H. Goods, J.J. Kelly and M.K. Miller, 'Thermal stability of Ni-Mn electrodeposits,' Acta Mater., vol. 54, pp. 1935-1947, 2006 https://doi.org/10.1016/j.actamat.2005.12.027