Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
권호 표지

Tensile Properties of Nickel Electroform(l)

니켈 전주층의 인장 물성(1)

  • Kim I. (Dept. of Materials and Metallurgical Engineering, Dong-eui University) ;
  • Lee J. (Dept. of Materials and Metallurgical Engineering, Dong-eui University) ;
  • Kang K. (Dept. of Materials and Metallurgical Engineering, Dong-eui University) ;
  • Kwon S.C. (Dept. of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Kim M. (Dept. of Surface Engineering, Korea Institute of Machinery & Materials) ;
  • Lee J.Y. (Dept. of Surface Engineering, Korea Institute of Machinery & Materials)
  • 김인곤 (동의대학교 재료금속공학과) ;
  • 이재근 (동의대학교 재료금속공학과) ;
  • 강경봉 (동의대학교 재료금속공학과) ;
  • 권식철 (한국기계연구원 표면연구부) ;
  • 김만 (한국기계연구원 표면연구부) ;
  • 이주열 (한국기계연구원 표면연구부)
  • Published : 2005.02.01
Download PDF
⟨ Previous Next ⟩

Abstract

Tensile properties and hardness of nickel electroform from chloride-free nickel sulfamate electrolyte at 50℃ and PH 4.5 were investigated. Current density varied from 20 to 60 mA/㎠. The deposit thicknesses were 360, 480 and 980 ㎛. It was found in 480 ㎛ thick electroform that highest tensile and yield strengths and hardness of 83.7 ksi, 53.6 ksi and 216 DPH, respectively were obtained at a current density of 40 mA/㎠ and they were slightly decreased at 20 and 60 mA/㎠. However the ductility was lowest of 7.9% at 40 mA/㎠. Such a high strength and low ductility at 40 mA/㎠ seems to be related to the narrower columnar structure than those of other current densities. All the deposits exhibited pronounced necking behavior. Tensile strength, yield strength and ductility increased as the nickel electroform thickens. Initial strong (200) texture developed on stainless steel mandrel decreased and (111) and (220) textures increased as deposit thickness increased, whereas (200) texture was preferred as the current density increased.

Keywords

References

  1. W. H. Safranek, The Properties of Electrodeposited Metals and Alloys, American Elsevier Publishing Company, INC. (1974)
  2. A. Brenner, V. Zentner, C. W. Jennings, Plating, August (1952)
  3. W. H. Safranek, Plating, October (1966)
  4. O. J. Klingenmaier, Plating, November (1965)
  5. B. B. Knapp, Plating, December (1971)
  6. J. W. Dini, H. R. Johnson, Thin Solid Films, 54 (1978) 183-188 https://doi.org/10.1016/0040-6090(78)90197-9
  7. F. Ebrahimi, Z. Ahmed, Materials Characterization 49 (2003) 373-379 https://doi.org/10.1016/S1044-5803(02)00305-4
  8. R. C. Barrett, Plating, September (1954)
  9. R. K. Asher, W. B. Harding, Plating, July (1962)
  10. G. A. Malone, D. M. Winkelman, 'High Performance Alloy Electroforming, Final Report', BAT REPERT NO. 8874-927001
  11. H. R. Johnson, J. W. Dini, R. E. Stoltz, Plating & Surface Finishing, March (1979)
  12. I. Kim, R. Weil, Thin Solid Films, 169, 35 (1989)
  13. I. Kim, J. Kor. Inst. Surf. Eng. 37(1) (2004)
  14. G. C. Ye, D. N. Lee, Plat. Surf. Finish. 68, April (1981)