Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 4 Serial No. 37
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- Pages.315-321
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
COG (Chip On Glass) Bonding Technology for Flat Panel Display Using Induction Heating Body in AC Magnetic Field
교류자기장에 의한 유도가열체를 이용한 평판 디스플레이용 COG (Chip On Glass) 접속기술
- Lee Yoon-Hee (Department of Materials Science and Engineering, Hongik University) ;
- Lee Kwang-Yong (Department of Materials Science and Engineering, Hongik University) ;
- Oh Tae-Sung (Department of Materials Science and Engineering, Hongik University)
- Published : 2005.12.01
Abstract
Chip-on-glass technology to attach IC chip directly on the glass substrate of flat panel display was studied by using induction heating body in AC magnetic field. With applying magnetic field of 230 Oe at 14 kHz, the temperature of an induction heating body made with Cu electrodeposited film of 5 mm
교류자기장에 의한 유도가열체를 이용하여 LCD 평판 디스플레이 패널의 가열을 최소화하면서 IC 칩을 실장시킬 수 있는 COG 접속기술에 대해 연구하였다. 크기 5mm