고속 디지털 회로 PCB 상의 EMI 해석

EMI Analysis on High Speed Digital Circuite

  • 발행 : 2005.12.01

초록

최근 정보량의 증가로 고속 디지털 회로를 요구하고 있다. 이에 따라 소형 고주파 회로에 전자기 특성이 중요하게 대두되었다. 그래서 불완전한 그라운드 상에 PCB 회로의 고속 디지털 전송라인에 대한 신호 집적도와 두 평행 선로 사이의 결합특성을 3차원 전자기 해석법인 시간영역 유한차분법을 이용하여 해석하였다. FDTD 시뮬레이션 결과는 상용 회로 소프트웨어 툴인 ADS 시뮬레이터와 비교하였고, 집중 소자 모델링, 주파수에 따른 슬롯에 의한 전자파의 방사 등을 해석하였다. 결과로써 마이크로스트립 선로 아래 슬롯이 있는 경우 신호의 전송에 큰 영향을 끼치는 것을 알 수 있다.

Recently, it has demanded high-speed digital circuits as information increase. Therefore, electromagnetic characteristics of compact microwave circuit occurred importantly. And, the effect of the imperfect ground plane on the signal integrity and influence of coupling between two parallel lines for high-speed digital transmission line on the printed circuit board is investigated by FDTD simulations in 3-D electromagnetic analysis method. The results of FDTD simulation are compared with the ADS simulation in commercial software, analyzed lumped element of modeling and electromagnetic wave's radiation of slot as frequency. As a consequence, when the slot in the ground plane is under microstrip line, it has much effect on propagation of wave.

키워드

참고문헌

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