Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating

전기도금법으로 제조한 Ni 박막의 전기비저항 및 솔더 반응성

  • Lee Kwang-Yong (Department of Materials Science and Engineering, Hongik University) ;
  • Won Hye-Jin (Department of Materials Science and Engineering, Hongik University) ;
  • Jun Sung-Woo (Department of Materials Science and Engineering, Hongik University) ;
  • Oh Teck-Su (Department of Materials Science and Engineering, Hongik University) ;
  • Byun Ji-Young (Center for Materials Processing, Korea Institute of Science and Technology) ;
  • Oh Tae-Sung (Department of Materials Science and Engineering, Hongik University)
  • 이광용 (홍익대학교 신소재공학과) ;
  • 원혜진 (홍익대학교 신소재공학과) ;
  • 전성우 (홍익대학교 신소재공학과) ;
  • 오택수 (홍익대학교 신소재공학과) ;
  • 변지영 (한국과학기술연구원 금속공정연구센터) ;
  • 오태성 (홍익대학교 신소재공학과)
  • Published : 2005.09.01
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Abstract

Characteristics of electroplated Ni films such as grain size, resistivity, solder wetting angle, and growth rate of intermetallic compound were evaluated as a function of electroplating current density. With increasing the electroplating current density from $5\;mA/cm^2 $ to $40\;mA/cm^2 $, the nodule size on the Ni film surface decreased, grain refinement occurred, and resistivity increased from $7.37\mu\Omega-cm$ to $9.13\mu\Omega-cm$. Compared with Ni film processed at $40\;mA/cm^2 $, Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ exhibited low resistivity, dense microstructure, and slow growth rate of intermetallic compound. Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ are more suitable for Ni UBM application than that fabricated at $40\;mA/cm^2 $.

도금전류밀도에 따른 Ni박막의 결정립 크기, 전기비저항, 솔더 wetting angle 및 금속간화합물의 성장속도를 분석하였다. 도금전류밀도를 $5\;mA/cm^2$에서 $40\;mA/cm^2$로 증가시킴에 따라 Ni 박막의 표면 nodule의 크기가 감소하고 결정립이 미세화 되었으며, 전기비저항이 $7.37\mu\Omega-cm$에서 $9.13\mu\Omega-cm$로 증가하였다. $5\;mA/cm^2$ 및 $10\;mA/cm^2$에서 도금한 Ni 박막이 $40\;mA/cm^2$에서 형성한 Ni 박막에 비해 전기비저항이 낮고 dense하며 계면 금속간화합물의 성장속도가 느리기 때문에 무연솔더의 UBM 용도로 더 적합할 것이다.

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