접착 및 계면 (Journal of Adhesion and Interface)
- 제4권2호
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- Pages.10-20
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- 2003
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- 1229-9243(pISSN)
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- 2233-8217(eISSN)
Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Promotion of Electroless Ni or Cu Films
- Romand, M. (Universit Claude Bernard-Lyon 1) ;
- Charbonnier, M. (Universit Claude Bernard-Lyon 1) ;
- Goepfert, Y. (Universit Claude Bernard-Lyon 1)
- 투고 : 2003.05.29
- 심사 : 2003.06.09
- 발행 : 2003.06.25
초록
This paper is relative to the electroless deposition of nickel or copper films on polyimide and polytetrafluoroethylene substrates. First, it is presented an original approach of the electroless process which consists in grafting nitrogenated functionalities on the polymer surfaces via plasma or VUV-assisted treatments operating in a nitrogen-based atmosphere (