References
- K.W. Ko, Y.J. Roh and H.S.Cho, 'A Neural Network Approach the Inspection of Ball Grid Array Solder Joints on Printed Circuit Boards,' IJCNN'2000 https://doi.org/10.1109/IJCNN.2000.861463
- M. Rooks, B. Benhabib, and K. C. Smith, 'Development of an inspection process for ball-grid-array technology using scanned beam x-ray laminography,' IEEE trans. on Components, Packing, and Manufacturing Technology-Part A. Vol. 18, No 4, December 1995, pp 851-861 https://doi.org/10.1109/95.477473
- Adams, 'X-ray laminography analysis of ultra fine pitch solder connections on ultra-thin boards,' Integrated Circuit Metrology, Inspection. and Process Control V(SPIE) Vol.1464. 1991, pp 484-497 https://doi.org/10.1117/12.44460
- Black, D. L. Millard, and K. Nilson, 'An animated interface for x-ray laminographic inspection of finepitch interconnect,' IEMT Symposium 1991, pp 207-211 https://doi.org/10.1109/IEMT.1991.279778
- A. E. M. Bocage, 'Laminographic imaging system for high energy radiation,' French Patent 536464(1922)
- R.P. Lippmann, 'An Introduction to Computing with Neural Nets,' IEEE ASSP Magazing, Vol. 4, pp.4-22, April, 1987 https://doi.org/10.1109/MASSP.1987.1165575
- R. P. Lippmann, 'Pattern Classification Using Neural Networks,' IEEE, 1989 https://doi.org/10.1109/35.41401
- Y.H. Pao, 'Adaptive Pattern Recognition and Neural Networks,' Addison-Wesley, pp 269-330, 1989
- Adaptive Pattern Recognition and Neural Networks Y.H.Pao