Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Influence of Pad Shape on Self-Alignment in BGA Soldering

BGA 솔더링에서 패드 형상이 자기정렬에 미치는 영향

  • 안도현 (한국과학기술원 기계공학과) ;
  • 정용진 (한국과학기술원 기계공학과) ;
  • 유중돈 (한국과학기술원 기계공학과) ;
  • 김용석 (홍익대학교 재료공학과)
  • Published : 2003.08.01
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Abstract

Effects of the circular and non-circular pad shapes on self-alignment in BGA soldering are predicted using Surface Evolver, and the calculated results are compared with experimental data. While the pad shape has minor effects on self-alignment in the vertical direction, self-alignment in the lateral direction depends on the pad direction and length ratio of the non-circular pad. Larger restoring force is obtained in the minor-axis direction than the major-axis direction, which suggests a possibility of reducing misalignment in the specific direction. The restoring force of the circular pad is between those of the non-circular pad in the major and minor-axis directions. The calculated results of Surface Evolver show reasonably good agreements with experimental data using the shear loading system.

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References

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