Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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The Study of Solderability according to Chemical Analysis in Plating Process

도금공정의 액 분석에 따른 Solderability 개선 연구

  • Published : 2003.04.01
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Abstract

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

Keywords

References

  1. K. Kulojarvi et. al., Micro electronics lnternationals, 152 (1998) 20-24
  2. M. G. Fontana, N. D. Greene, Corrosion Engineering, 2nd ed., McGrawHill, (1978) 297-346
  3. H. H. Uhlig, R. W. Revie, Corrosion, Corrosion Control, 3th ed., John & Son Inc., NY.,(1985) 44
  4. Standard Method for Making Potentiostatic, Potentiodynamic Anodic Measurement, Standard Method G5-82, Annual Book of ASTM Standards
  5. E. R. Brown, J. R. Sandifier, Physical Methodsof Chemistry, Vol II, Methods, B. W. Rossiter J. F. Hamilton Editor, John Wiley & Inc.,(1986)
  6. N. Sato, G. Okamoto, in: ComprehensiveTreaties of Electrochemistry, Vol. 4, Press,NY., (1981) 194
  7. S. K. Coburn, Y-W. Kim, Metal Handbook,Vol. 13, Corrosion, 9th ed., ASM Metals Park, OH., (1987) 515
  8. G. W. Graff, Ceramics: Primed for a Broader Industrial Role, Chem. Eng., (1983) 14
  9. D. A. Jones, Principles, Prevention of Corrosion, Macmillan Publishing NY., (1992) 85
  10. H. Wroblowa, V. Brusic, J. O'M Bockris, J.Phys. Chem. 75, (1971) 2823 https://doi.org/10.1021/j100687a019
  11. P. G Harhs et. al., Soldering & Surface MountTech., 10, 3 (1908) 38-52
  12. K. Wassink, Soldering in electronics, 2nd ed (1989) 149-159
  13. F. G. Yost, F. M. Hosking, D. R. Frear, The Mechanics of Solder Alloy, Wetting, Spreading, NY, Van Nostrand, (1993)
  14. D. R. Frear, W. B, Jones, K. R. Kinsman, Solder Mechanics, TMS, (1991)
  15. J. Y. Park, C. S. Kang, J. P. Jung, J. Electron Mater., 28 (1999) 1256 https://doi.org/10.1007/s11664-999-0165-0
  16. I. Artaki, A. M. Jackson, P. T. Vianco, J. Electron. Mater., 23 (1994) 757 https://doi.org/10.1007/BF02651370
  17. C. Lea, A Scientific Guide to Surface Mount Technology, Electrochemical Publications,(1988)