References
- J. Kor. Ceram. Soc. v.38 no.8 Preparation of PZT Piezoelectric Thick Film by Screen Printing Method Y.B.Kim;D.J.Choi;S.J.Yoon;H.J.Jung;T.S.Kim
- Handbook of Glass Properties N.P.Bansal;R.H.Doremus
-
J. Kor. Ceram. Soc.
v.39
no.2
Properties and Structures of
$Bi_{2}O_{3}-B_{2}O_{3}-ZnO$ Glasses for Application in Plasma Display Panels Rib Y.H.Jin;Y.W.Jeon;B.C.Lee;B.K.Ryu https://doi.org/10.4191/KCERS.2002.39.2.184 - Electrochemical Methods A.J.Bard;L.R.Faulkner
- Electrochemistry P.H.Rieger
- Electrochemistry for Chemist s D.T.Sawyer;A.Sobkowiak;J.L.Roberts. Jr
- J. Ceram. Soc. Jpn v.97 no.3 The Role of Glasses on Alumina-Glass Composites K.Kata;I.Yasui https://doi.org/10.2109/jcersj.97.314
- J. Kor. Ceram. Soc. v.37 no.7 Effects of Volume Fraction & Particle Size of Alumina on Sintering Behaviors of the Glass-alumina Composites for Low Firing Temperature D.H.Park;B.C,Kim;J.J.Kim;;L.S.Park
- J. Am. Ceram. Soc. v.85 no.12 Physical Properties of Barrier Ribs of Plasma Display Panels: I, Formation of Pores during Sintering of Lead Borosilicate Glass Frits G.H.Hwang;H.J.Jeon;Y.S.Kim https://doi.org/10.1111/j.1151-2916.2002.tb00562.x
-
J. Am.Ceram. Soc.
v.64
no.12
Preparation of High-density
$Si_{3}N_{4}$ by a Gas-pressure Sintering Process C.Greskovich https://doi.org/10.1111/j.1151-2916.1981.tb15895.x - J. Am. Ceram. Soc. v.59 no.3 Pore Growth in Sintered Thoria C.S.Morgan;K.H.Mccorkle https://doi.org/10.1111/j.1151-2916.1976.tb09441.x
- J. Kor. Ceram. Soc. v.37 no.6 Effects of Glass Particle Size on Sintering Behaviors of the Glass-Alumina Composites for Low Firing Temperature D.H.Park;B.C.Kim;J.J.Kim;L.S.Park
- J. Kor. Ceram. Soc. v.29 no.11 Particle Agglomerate Effect on Intermediate/Final Microstructure Y.D.Son;B.S.Jun
- Acta Metall. v.39 no.9 A Theoretical Analysis of Solution-precipitation Controlled Densification during Liquid Phase Sintering O.H.Kwon;G.L.Messing https://doi.org/10.1016/0956-7151(91)90176-2
- IEEE Trans. Electr. Insul. v.EI-21 no.3 Analysis of Electric Stress Distribution in Cavities Embedded within Dielectric Structures D.D.Chang;T.S.Sudarshan;J.E.Thompson https://doi.org/10.1109/TEI.1986.348947
- IEEE Trans. Electr. Insul. v.EI-21 no.3 Prebreakdown Processes Associated with Surface Flashover of Solid Insulator in Vacuum T.S.Sudashan;J.D.Cress;K.D.Srivastava
- J. Appl. Phys. v.30 no.11 Dielectric Breakdown of Porous Ceramics R.Gerson;T.C.Marshall https://doi.org/10.1063/1.1735030