한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제15권10호
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  • Pages.851-857
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  • 2002
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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실리카 슬러리의 희석과 연마제의 첨가가 CMP 특성에 미치는 영향

Effects of Diluted Silica Slurry and Abrasives on the CMP Characteristics

  • 발행 : 2002.10.01
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초록

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi~level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused how to reduce the consumption of raw slurry In this paper, we presented the pH changes of diluted slurry and pH control as a function of KOH contents. Also, the removal rates of slurry with different dilution ratio were investigated. Finally, the CMP characteristics were discussed as a function of silica (SiO$_2$) abrasive contents.

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참고문헌

  1. Journal of Materials Science : Materials in Electronics v.12 no.1 An optimization of tungsten plug chemical mechanical polishing(CMP) using different consumables W. S. Lee;S. Y. Kim;Y. J. Seo;J. K. Lee https://doi.org/10.1023/A:1011276830620
  2. Electrochem. Soc. Proc. v.99 Study of micro-defect on oxide CMP in VLSI circuits S. Y. Kim;Y. J. Seo;W. S. Lee;E. G. Chang
  3. Journal of Electrochemical Society v.138 Application of chemical mechanical polishing to the fabrication of VLSI circuit interconnection William J. Patrick
  4. Proceeding of VMIC Optimization of chemical mechanical polishing from the viewpoint of consumable effect J. Luo;D. Dorfeld
  5. 전기전자재료 v.12 no.10 Chemical Mechanical Polishing 공정 기술의 이해 장의구
  6. 전기전자재료 v.12 no.10 CMP 공정에 사용되는 연마 소모자재의 기술의 이해 정해도
  7. 전기전자재료 v.12 no.10 Chemical Mechanical Polishing 공정 변수의 이해 김상용
  8. Trends in Materials, Information Center for Materials v.1 CMP(Chemical Mechanical Polishing) 공정 김종필;백운규
  9. Chemical Mechanical Planarization of Microelectronic Materials J. M. Steigerwald;S. P. Murarka;R. J. Getmann