Abstract
The subsurface stress field beneath the roller's contacting surface due to the contact pressure in lubricating condition has been calculated. Main purpose of this study in view of engineering is to prove the validity of the numerical profile roller presented by Koo et al. The Love's rectangular patch solution was used to obtain the subsurface stress field. The stress field of the numerical profile roller was compared with the one of the existing dub-off profile roller The analysis results show reduced subsurface stresses for the numerical profile roller.