참고문헌
- 전기전자재료학회논문지 v.14 no.8 Cl₂/O₂가스에 의한 크롬 박막의 직각 특성 고찰 박희찬;강승열;이상균;최복길;권광호
- 전기전자재료학회논문지 v.14 no.7 유도결합 플라즈마에 의해 식각된 PZT 박막의 식각 Damage 개선 강명구;김경태;김창일
- 전기전자재료학회논문지 v.14 no.3 OES를 이용한 SBT박막의 식각 특성 연구 신성욱;김창일;장의구
- IEEE Trans.Elec.Dev v.38 Two-dimensional implications of a purely reactive model for plasma etching A.Gerodolle;J.Pelletier https://doi.org/10.1109/16.83725
- IEEE Trans. Semi.Manufact v.4 Statistical experimental design in plasma etch modeling G.May;J.Huang;C.Spanos https://doi.org/10.1109/66.79720
- IEEE Trans. Comp. Packag. Manufact.Technol. v.19 no.3 Reactive ion etching using neural networks and simulated annealing B.Kim;G.May
- Design and Analysis of Experiments D.Montgomery
- Parallel Distributed Processing D.E.Rummelhart;J.L.McClelland
- 6th IEEE Internat. Symp.Indus.Elect v.1 Using neural networks with a linear output neuron to model plasma etch process B.Kim;W.Choi;H.Kim
- IEEE Trans. Semicond. Manufact v.7 An optimal neural network process model for plasma etching B.Kim;G.S.May https://doi.org/10.1109/66.286829
- Chemometr.Intell.Lab.Syst v.56 no.1 An optimal neural network plasma model:a case study B.Kim;S.Park https://doi.org/10.1016/S0169-7439(01)00107-1
- Plasma Etching in Semiconductor Fabrication R.A.Morgan
- 한국진공학회지 v.6 no.3 실리카 도파로 제작을 위한 inductively coupled plasma에 의한 산화막 식각 특성 연구 박상호;권광호;정명영;최태구
- J.Appl.Phys v.52 no.3 Spectroscopic diagnostics of CF₄-O₂plasmas during Si and SiO₂ etching processes Ricardo dAgostino;Francesco Cramarossa;Santolo De Benedictis;Giovanni Ferraro https://doi.org/10.1063/1.329748
- J.Appl.Phys v.50 Reaction of fluorine atoms with SiO₂ D.L.Flamm;C.J.Mogab;E.R.Sklaver https://doi.org/10.1063/1.325755
- Semiconductor International v.11 no.10 Etch silicon dioxide with high selectivity and low polymer formation G.Z.Yin;M.Bender;R.Mundt;M.S.Chang;D.Rafinejad
- Nuclear Instruments and Methods v.111 The behaviour of perfluoro polyether and other vacuum fluids under ion and electron bombardment L.Holland;L.Laurenson;R.E.Hurley;K.Williams https://doi.org/10.1016/0029-554X(73)90216-4