Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 8 Issue 4
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- Pages.47-52
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- 2001
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
A Study on the Implementation of Wave Soldering Process and the Solder Joint Reliability Using Sn-Cu-Ni Lead-free Solder
Sn-Cu-Ni계를 이용한 Pb-free Wave Soldering의 공정 적용 및 신뢰성에 관한 연구
Abstract
Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test.
Sn-Cu-Ni계 솔더를 이용한 AC Adapter의 Pb-Free Wave 솔더링 공정을 Six Sigma기법으로 개발하였다. 솔더 접합부의 외관, 미세조직, Lift-off현상 및 Crack발생 유.무를 관찰하여 접합기구를 규명하고자 하였으며 열 충격시험을 통하여 신뢰성평가를 수행하였다. 솔더 접합부의 Sn-Cu-Ni계 솔더와 Cu Land 사이에는 약 5
Keywords
- Sn-Cu-Ni solder;
- AC adapter;
- Solder joint reliability;
- Wave soldering;
- Intermetallic compound;
- Lift-off