Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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A Study of Wire Sweep, Pre-conditioning and Paddle Shift during Encapsulation of Semiconductor Chips

반도체 칩 캡슐화 성형 공정에 있어서 와이어 스윕 및 패들 변형에 관한 연구

  • 한세진 (미국 코넬대학교 기계항공 공학부) ;
  • 허용정 (한국기술대학교 메카트로닉스 공학부) ;
  • 이성철 (인하공업전문대학 기계과)
  • Published : 2001.02.01
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Abstract

In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.

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References

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