한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제32권3호
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- Pages.423-427
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- 1999
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Plating of Permalloy Using Flow Cell
- Jeon, S.H. (School of Materials Science and Engineering, Seoul National University) ;
- Ahn, J.H. (School of Materials Science and Engineering, Seoul National University) ;
- Kang, T. (School of Materials Science and Engineering, Seoul National University)
- 발행 : 1999.06.01
초록
Electroplating of 80%Ni permalloy thin plate for magnetic core materials. was studied The convected flow of electrolyte was used for stirring methode. The current density could be increased up to 250mA/