Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 32 Issue 3
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- Pages.214-218
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- 1999
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
THE EFFECTS OF ADDITIVES IN NICKEL AND COPPER ELECTROPLATING FOR MICROSTRUCTURE FABRICATION
- Kim, Go-Eun (Dept. of Metallurgical Engineering and Materials Science Hongik University) ;
- Lee, Jae-Ho (Dept. of Metallurgical Engineering and Materials Science Hongik University)
- Published : 1999.06.01
Abstract
The effect of additives in nickel and copper electroplating were investigated for MEMS applications. Saccharin and gelatin were used as additives in nickel and copper electroplating bath respectively. The morphology and surface hardness of electroplated coating were investigated with additive concentration. Microstructures were fabricated with optimum conditions.