Analysis of Surface Crack under Tension and Bending Stress in Plate

인장과 굽힘응력을 받는 판재의 표면균열해석

  • Published : 1998.07.01

Abstract

In this study, when tension and bending stress act on plate simultaneously, stress intensity factor is analyzed at crack tip with using BEM(Boundary Element Method). In this analysis, stress intensity factors(S.I.F) are defined for variable ligament, aspect and stress ratio($\sigma$T/$\sigma$B). Consequently, predicted that crack grow to depth direction at low aspect and ligament ratio in tension stress and to surface direction in bending stress. Tension and bending stress act on plate same time, effect of tension stress in the first stage and effect of bending stress in the after stage was to observed. The outbreak of secondary crack in backside is under the control of stress amplitude and predict that the point of outbreak is mear backside.

Keywords

References

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