참고문헌
- Circuits, Interconnections, and Packaging for VLSI H.B.Bakoglu
- Proceedings of the IEEE v.83 no.4 Trends in Low-Power RAM Circuit Technologies K.Itoh;K.Sasaki;Y.Nakagome
- DRAM design 유희준
- IEEE Transactions on Electron Devices v.ED-30 no.2 Simple Formulas for Two-and Three-Dimensional Capacitances T.Sakurai;K.Tamaru
- Design Automation Conference Tutorial Electrical Design of Packaging Paul Franzon
- 슬라이드 모음집, Technical Report, no.PIRLTR-97-9 High Speed Digital 회로에서의 transmission line 효과, crosstalk, termination 및 ground bounce 현상 박홍준;박종훈;김찬경
- 박사학위논문, 포항공과대학교 DRAM칩과 SIMM메모리 모듈의 신호보전성 분석에 관한 연구 박종훈
- Technical Report, no.PIRL-TR-97-7 DRAM동작을 포함한 메모리 모듈의 시간영역 분석을 위한 HSPICE회로모델 박종훈;김찬경;박홍준
- 3th ICVC A Measurement-based SPICE Circuit Modeling of VLSI Package Inductances Using the RAPHAEL 3D Simulation Program Jong-Hoon Park;Hong-June Park
- 전자공학회논문집 v.31(A편) no.10 RAPHAEL 프로그램을 이용한 인텔 I486 마이크로 프로세서의 168 pin PGA 패키지 인덕턴스 모델링 박종훈;박홍준
- High-Speed Digital Design:A Handbook of Black Magic H.W.Johnson;M.Graham
- 5th ICVC Modeling and Analysis of On-Chip and Off-Chip Power Supply Network K.Lee
- Second Edition Noise Reduction Techniques in Electronic Systems H.W.Ott
- EPFL 단기강좌 EMI/EMC Effects in IC Design V.K.Tripathi
- 5th ICVC A Simultaneous Swiching Noise Analysis System and It's Application to High Speed Memory Module Design J.H.Choi(et al)
- International Journal of High Speed Electronics and Systems v.6 no.4 Simultanemous Switching Noise Analysis of a 16MB×9 DRAM SIMM Memory Module Jong-Hoon Park;Hong-June Park;Bo-Kyoung Choi;Oh-Hyun Kim;Si-Don Choi
- 5th ICVC Investigation of Requirements for High-Speed DRAM Interface using Rambus-C as an Example Chan-Kyong Kim;Jong-Ki Nam;Jae-Yoon Sim;Hong-June Park;Jong-Sun Kim;Soo-In Cho