도선 모델링(Interconnect Modeling)기술

참고문헌

1. Circuits, Interconnections, and Packaging for VLSI H.B.Bakoglu
2. Proceedings of the IEEE v.83 no.4 Trends in Low-Power RAM Circuit Technologies K.Itoh;K.Sasaki;Y.Nakagome
3. DRAM design 유희준
4. IEEE Transactions on Electron Devices v.ED-30 no.2 Simple Formulas for Two-and Three-Dimensional Capacitances T.Sakurai;K.Tamaru
5. Design Automation Conference Tutorial Electrical Design of Packaging Paul Franzon
6. 슬라이드 모음집, Technical Report, no.PIRLTR-97-9 High Speed Digital 회로에서의 transmission line 효과, crosstalk, termination 및 ground bounce 현상 박홍준;박종훈;김찬경
7. 박사학위논문, 포항공과대학교 DRAM칩과 SIMM메모리 모듈의 신호보전성 분석에 관한 연구 박종훈
8. Technical Report, no.PIRL-TR-97-7 DRAM동작을 포함한 메모리 모듈의 시간영역 분석을 위한 HSPICE회로모델 박종훈;김찬경;박홍준
9. 3th ICVC A Measurement-based SPICE Circuit Modeling of VLSI Package Inductances Using the RAPHAEL 3D Simulation Program Jong-Hoon Park;Hong-June Park
10. 전자공학회논문집 v.31(A편) no.10 RAPHAEL 프로그램을 이용한 인텔 I486 마이크로 프로세서의 168 pin PGA 패키지 인덕턴스 모델링 박종훈;박홍준
11. High-Speed Digital Design:A Handbook of Black Magic H.W.Johnson;M.Graham
12. 5th ICVC Modeling and Analysis of On-Chip and Off-Chip Power Supply Network K.Lee
13. Second Edition Noise Reduction Techniques in Electronic Systems H.W.Ott
14. EPFL 단기강좌 EMI/EMC Effects in IC Design V.K.Tripathi
15. 5th ICVC A Simultaneous Swiching Noise Analysis System and It's Application to High Speed Memory Module Design J.H.Choi(et al)
16. International Journal of High Speed Electronics and Systems v.6 no.4 Simultanemous Switching Noise Analysis of a 16MB×9 DRAM SIMM Memory Module Jong-Hoon Park;Hong-June Park;Bo-Kyoung Choi;Oh-Hyun Kim;Si-Don Choi
17. 5th ICVC Investigation of Requirements for High-Speed DRAM Interface using Rambus-C as an Example Chan-Kyong Kim;Jong-Ki Nam;Jae-Yoon Sim;Hong-June Park;Jong-Sun Kim;Soo-In Cho