Journal of the Korean Vacuum Society (한국진공학회지)
- Volume 4 Issue S1
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- Pages.102-107
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- 1995
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- 1225-8822(pISSN)
CVD and Sputtering-reflow Copper Metalization Technique with CMP
- Hoshino, M. (Fujitsu Ltd., 1015 Kamikodanaka Nakahara-ku) ;
- Furumura, Y. (Fujitsu Ltd., 1015 Kamikodanaka Nakahara-ku)
- Published : 1995.02.01
Abstract
We review the copper CVD line, via fill properties, and CMP line resistance. With CVD, trenches and vias with high aspect ratio(above 3) can be filled completely. Sputtering-reflow technique, a new method to filling copper into lines, is also reviewed to compare the CVD process.
Keywords