Advanced Materials Delivery Successes in CVD Processing

As silicon divice geometrics become smaller and aspect ratios larger, processing technoloty is moving from PVD into the area of CVD and OMCVD. Many new source materials are in the research and development stage, and have placed challenging demands on materials delivery technology. This paper will describe the many successes achieved with various delivery methods including thermal, bubblers, pressure-based and Direct Liquid Injection.