Surface grinding of WC-Co with high quality

WC-Co의 고품위 평면 연삭가공

Presently, abrasive processing is on eof several methods for cutting and grinding brittle materials, and high quality in dimensional accuracy and surface roughness are often required as a structural components, therefore most of them has to be ground. In manufacturing of tungsten-carbide components, grinding by diamond wheel is usually adopted in order to provide configurational and dimensional accuracy to the components. The present study proposes the experi- mental research of optimum condition to the high quality surface grinding of the WC-Co material using diamond abrasive wheel in order to minimize the damage on the ground surface and to pursue the precise dimension by conventional grinding machine. Brief investigation is carried out to decrease the dressing is constant, theoretical grinding effect such as machining precision is changed according to the speed of workpiece. Accordingly, normal and tangential grinding forces, which are Fn, Ft were analyzed for the machining processes of WC-Co material to obtain optimum grinding conditions, 3-point bending test is carried out to check machining damage on the ground surface layer, which is one of sintered brittle materials.