Journal of the Korean Society for Precision Engineering (한국정밀공학회지)
- Volume 11 Issue 1
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- Pages.150-156
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- 1994
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- 1225-9071(pISSN)
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- 2287-8769(eISSN)
Measurement methodology for the alignment accuracy of wafer stepper
웨이퍼 스텝퍼의 정렬정확도 측정에 관한 연구
- Lee, Jong-Hyun ;
- Jang, Won-Ick ;
- Lee, Yong-Il ;
- Kim, Doh-Hoon ;
- Choi, Boo-YeonNam, Byung-HoKim, Sang-CheolKim, Jin-Hyuk
- 이종현 (한국전자통신연구소, 노광기술연구실) ;
- 장원익 (한국전자통신연구소, 노광기술연구실) ;
- 이용일 (한국전자통신연구소, 노광기술연구실) ;
- 김도훈 (한국전자통신연구소, 노광기술연구실) ;
- 최부연남병호김상철권진혁 (한국전자통신연구소, 노광기술연구실영남대학교, 물리학과영남대학교, 물리학과영남대학교, 물리학과 )
- Published : 1994.02.01
Abstract
To meet the process requirement of semiconductor device manufacturing, it is necessary to improve the alignment accuracy in exposure equipments. We developed the excimer laser stepper and will describe the methodology for alignment measurement and experimental results. Our wafer alignment system consists of off-axis optics, TTL(Through The Lens) optics and high precision stage. Off-axis alignment utilizes the image processing and /or diffraction from thealign marks of off-centered chip area. On the other hand, TTL alignment can be used for the die-by-die alignment using dual beam interferometry. When only off-axis alignment was used, the experimental alignment error(lml+3 .sigma. ) was 0.26-0.29 .mu. m, and will be reduced down to 0.15 .mu. m by adding TTL alignment.