Electrical & Electronic Materials (E2M - 전기 전자와 첨단 소재)
- Volume 7 Issue 5
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- Pages.425-429
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- 1994
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- 2982-6268(pISSN)
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- 2982-6306(eISSN)
A study on the E-beam resist characteristics of plasma polymerized styrene
플라즈마중합 스티렌 박막의 e-beam 레지스트 특성에 관한 연구
Abstract
In this paper, we study on the plasma polymerized styrene as a negative electron-beam resist. Plasma polymerized thin film was prepared using an interelectrode inductively coupled gas-flow type reactor. We show that polymerization parameters of thin film affect sensitivity and etching resistance of the resist. Molecular weight distribution of plasma polymerized styrene is 1.41-3.93, and deposition rates of that are 32-383[.angs./min] with discharge power. Swelling and etching resistance becomes . more improved with increasing discharge power during plasma polymerization. Etch rate by RIE is higher than that by plasma etching.
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