대한기계학회논문집 (Transactions of the Korean Society of Mechanical Engineers)
- 제16권1호
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- Pages.22-30
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- 1992
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- 1225-5963(pISSN)
DOI QR Code
웨이퍼 가공기의 진동 해석 및 실험적 검증
Vibration Analysis of Wafer Cutting Machine and its Experimental Verification
초록
The free vibrations of the outer-clamped spinning annular disk which simulates a wafer cutting machine are investigated. The effects of the initial tension, the centrifugal force and outer-fixture extension caused by spinning on the vibration characteristics of the disk are considered. The modal parameters of the disk are calculated by using Galerkin's method as the rotating speed and initial tension are varied. Laboratory experiments are also performed with a rotating and stationary disk, and, it is found that experimental and simulation results are in good agreement.