Direct Measurement of the VLSI Interconnection Line Capacitances Using a Grounded Shield Plate

접지된 Shield Plate를 이용한 집적회로의 배선용량 측정

A noble interconnection line capacitance measurement method to be able to remove the measurement errors from the probe pad to substrate stray capacitance has been proposed and verified. The measurement errors in the capacitance measurement, which usually be involved from the probe pad to substrate stray capacitance, can easily be removed by isolating the metal probe pad from the substrate with a grounded shield plate between the probe pad the substrate. The measurement results by using this improved capacitance measurement method were compared with the calculations by two-dimensional computer simulations.