Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2013.05a
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- Pages.525-526
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- 2013
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- 2005-8446(pISSN)
Development of Ultrasonic Welding Condition for Improvement of Release Film Adhesive Strength in Hot Press Process
열압착 공정에서 이형필름 접착력 향상을 위한 초음파 융착조건 개발
- Published : 2013.05.29