한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2009년도 추계학술대회 논문집
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- Pages.81-81
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- 2009
Dielectric Properties of ink-Jet printed $Al_2O_3$ -resin Hybrid Films
- Hwang, Myung-Sung (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
- Jang, Hun-Woo (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
- Kim, Ji-Hoon (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
- Kim, Hyo-Tae (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
- Yoon, Young-Joon (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
- Kim, Jong-Hee (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
- Moon, Joo-Ho (Department of Advanced Material Engineering, Yonsei University)
- 발행 : 2009.11.12
초록
Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed