Fault Detection in Semiconductor Manufacturing Using Statistical Method

  • Lim, Woo-Yup (Department of Electronic Engineering, Myongji University) ;
  • Jeon, Sung-Ik (Department of Information Engineering, Myongji University) ;
  • Han, Seung-Soo (Department of Information Engineering, Myongji University) ;
  • Soh, Dae-Wha (Department of Electronic Engineering, Myongji University) ;
  • Hong, Sang-Jeen (Department of Electronic Engineering, Myongji University)
  • Published : 2009.11.12

Abstract

Fault detection is necessary for yield enhancement and cost reduction in semiconductor manufacturing. Sensory data acquired from the semiconductor processing tool is too large to analyze for the purpose of fault detection and classification(FDC). We studied the techniques of fault detection using statistical method. Multiple regression analysis smoothly detected faults and can be easy made a model. For real-time and fast computing time, the huge data was analyzed by each step. We also considered interaction and critical factors in tool parameters and process.

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