대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2009년도 제40회 하계학술대회
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- Pages.1501_1502
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- 2009
표면처리 공정 조건에 따른 SoQ 접합의 접합 특성에 관한 연구
A study on bonding characteristics of SoQ bonding according to surface treatment process conditions
- Kim, Jong-Wan (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Song, Eun-Seok (School of Electrical Engineering and Computer Science, Seoul National University) ;
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Kim, Yong-Kweon
(School of Electrical Engineering and Computer Science, Seoul National University) ;
- Baek, Chang-Wook (School of Electrical and Electronics Engineering, Chung-Ang University)
- 발행 : 2009.07.14
초록
Plasma treatment time was optimized to maximize the bonding strength between silicon and quartz. Bonding strength between the silicon and quartz is related to a surface energy which can be calculated by contact angle measurement. It was found that optimized time to get maximized surface energy was 15 sec. Silicon and quartz wafers were treated with
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