Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.06a
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- Pages.62-62
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- 2008
The characteristics of bismuth magnesium niobate multi layers deposited by sputtering at room temperature for appling to embedded capacitor
임베디드 커패시터로의 응용을 위해 상온에서 RF 스퍼터링법에 의한 증착된 bismuth magnesium niobate 다층 박막의 특성평가
- Ahn, Jun-Ku (School of Nano Science and Technology, Chungnam National University) ;
- Cho, Hyun-Jin (School of Nano Science and Technology, Chungnam National University) ;
- Ryu, Taek-Hee (School of Nano Science and Technology, Chungnam National University) ;
- Park, Kyung-Woo (School of Nano Science and Technology, Chungnam National University) ;
- Cuong, Nguyen Duy (BK21 Edu Center for Advanced Intelligent Components and Materials, Chungnam National University) ;
- Hur, Sung-Gi (School of Nano Science and Technology, Chungnam National University) ;
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Seong, Nak-Jin
(BK21 Edu Center for Advanced Intelligent Components and Materials, Chungnam National University) ;
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Yoon, Soon-Gil
(School of Nano Science and Technology, Chungnam National University)
- 안준구 (충남대학교 공과대학 나노공학부) ;
- 조현진 (충남대학교 공과대학 나노공학부) ;
- 유택희 (충남대학교 공과대학 나노공학부) ;
- 박경우 (충남대학교 공과대학 나노공학부) ;
- 웬지긍 (충남대학교 BK21 첨단부품소재센터) ;
- 허성기 (충남대학교 공과대학 나노공학부) ;
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성낙진
(충남대학교 BK21 첨단부품소재센터) ;
-
윤순길
(충남대학교 공과대학 나노공학부)
- Published : 2008.06.19
Abstract
As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below