대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2007년 추계학술발표대회 개요집
- /
- Pages.232-234
- /
- 2007
저융점 합금 필러를 이용한 도전성 접착제의 유동해석
Characteristics of Conductive Adhesives Using Low-Melting-Point Alloy Fillers
- 발행 : 2007.11.15
초록
This study conducts numerical simulations of Isotropic conductive adhesives using low melting point alloy fillers during the reflow process. The CIP method and predictor-corrector method are used to simulate more accurately on free surface flow of low melting point alloy fillers. For finding out optical conditions to obtain reliable conduction paths, the present study conducts extensive numerical simulations.
키워드