Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2007.05a
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- Pages.1724-1729
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- 2007
Development of Reliability Design Technology about Electrochemical Migration by Metal of Electronic Components
전자부품의 금속소재에 따른 Electrochemical Migration에 대한 신뢰성 설계기술개발
- Published : 2007.05.30
Abstract
Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature/humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the Electrochemical migration