Development of Reliability Design Technology about Electrochemical Migration by Metal of Electronic Components

전자부품의 금속소재에 따른 Electrochemical Migration에 대한 신뢰성 설계기술개발

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature/humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the Electrochemical migration