Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2007.11a
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- Pages.327-328
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- 2007
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- 2005-8446(pISSN)
Analysis on the Electrical Resistance Characteristic of FLIP CHIP Bonded Junction using ACF Flim
ACF 필름을 이용한 FLIP CHIP 본딩시 전기저항 특성 분석
Abstract
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